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专利名称：Low inductance decoupling capacitor
arrangement
发明人：Laurie P. Fung申请号：US08/716842申请日：19960919公开号：US05731960A公开日：19980324
摘要：A noise suppression apparatus for a printed circuit board (PCB) having two PCBpad regions, each containing a boundary pad region and a mounting pad region, whereinboth boundary pad regions contain via connections. A decoupling capacitor is coupled toboth mounting pad regions. Both boundary pad regions are solder mask except themounting pad regions and the via connections.
申请人：BAY NETWORKS, INC.
代理机构：Blakely, Sokoloff Taylor & Zafman
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