专利内容由知识产权出版社提供
专利名称：Method and system for measuring
temperature and power distribution of adevice
发明人：Hendrik F. Hamann,James A. Lacey,Martin P.
O'Boyle,Robert J. von Gutfeld,Jamil A.Wakil,Alan J. Weger
申请号：US10919692申请日：20040817公开号：US07167806B2公开日：20070123
专利附图：
摘要：A present invention provides real-time temperature and power mapping of fullyoperating electronic devices. The method utilizes infrared (IR) temperature imaging, whilean IR-transparent coolant flows through a specially designed cell directly over theelectronic device. In order to determine the chip power distributions the individualtemperature fields for each heat source of a given power and size on the chip (as realizedby a scanning focused laser beam) are measured under the same cooling conditions. Thenthe measured chip temperature distribution is represented as a superposition of thetemperature fields of these individual heat sources and the corresponding powerdistribution is calculated with a set of linear equations.
申请人：Hendrik F. Hamann,James A. Lacey,Martin P. O'Boyle,Robert J. vonGutfeld,Jamil A. Wakil,Alan J. Weger
地址：Yorktown Heights NY US,Mahopac NY US,Cortlandt Manor NY US,New York NYUS,Wappingers Falls NY US,Mohegan Lake NY US
国籍：US,US,US,US,US,US
代理机构：Fleit, Kain, Gibbons, Gutman, Bongini & Bianco P.L.
代理人：Jon A. Gibbons
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