专利内容由知识产权出版社提供
专利名称：Method of manufacturing laser diode
packages and arrays
发明人：Edward F. Stephens, IV申请号：US12009458申请日：20080118公开号：US07724791B2公开日：20100525
专利附图：
摘要：A laser diode package according to the present invention is composed of CTEmismatched components soldered together. The laser diode package includes a laserdiode bar, at least one heat sink, and at least one exothermic layer. Solder layers are
adjacent the heat sink(s) and laser diode bar, respectively. The exothermic layer(s) arepositioned between the solder layers. The exothermic layer(s) are exposed to an energysource which causes an exothermic reaction to propagate through the exothermic layerthereby melting the solder layers and solder layers. The exothermic layer(s) may bedesigned to provide sufficient heat to melt the solder layers and solder layers butprovide only minimal heat to the laser diode bar and heat sink(s). Several packages canbe stacked together to form a laser diode array.
申请人：Edward F. Stephens, IV
地址：Golden Eagle IL US
国籍：US
代理机构：Nixon Peabody LLP
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