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专利名称：Lead frame for semiconductor device发明人：Lumbard, Marvin申请号：EP88121320.1申请日：19881220公开号：EP0331814B1公开日：19931027
摘要：A lead frame and method for processing the lead frames from a continuousstrip of lead frames (11). A first insulation support member (30) and a second insulativesupport member (32) are first molded to the lead frame. After the support members areformed, the positioning member for supporting the leads within the lead frame isstamped from the lead frame. After an integrated circuit (IC) is connected to the leads,the IC can be tested within the lead frame since the leads are electrically isolated fromthe lead frame and each other. Finally the IC can be encapsulated and the leads severedfrom the lead frame assembly.
申请人：SIEMENS AG
地址：DE
国籍：DE
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